Sputtering technology is a type of physical vapor deposition (PVD) technique that is used to deposit thin films of materials onto a substrate surface. The process involves the use of a high-energy source, such as an electric arc or plasma, to bombard a solid target material with ions. This causes the atoms of the target material to be ejected from the surface and deposited onto the substrate surface.
The sputtering process works on the principle of momentum transfer between the ions and the target material. The ions are accelerated towards the target material by an electric field, and when they collide with the target material, they transfer their momentum to the atoms of the target material. This causes the atoms to be ejected from the surface of the target material and to travel through a vacuum chamber to the substrate surface.
The sputtering process is highly controlled and precise, as the thickness and uniformity of the deposited film can be controlled by adjusting the process parameters. These parameters include the energy and flux of the ions, the pressure and composition of the gas in the vacuum chamber, and the distance between the target material and the substrate surface.
Sputtering technology is widely used in a range of industrial applications, including microelectronics, optics, and wear-resistant coatings. It is capable of depositing films of a wide range of materials, including metals, semiconductors, and insulators.
One of the main advantages of sputtering technology is its ability to deposit highly uniform and precise thin films. The resulting film is highly conformal, meaning that it can coat complex and irregularly shaped substrates with high accuracy and consistency.
Another advantage of sputtering is the deposition of high boiling point material. These materials, such as boron nitride [1] usually can't be evaporized easily with tradional methods, while sputtering shall be able to get small pieces of material into the chamber.
In addition, sputtering technology is highly versatile and can be used to deposit films with a wide range of thicknesses, from a few nanometers to several microns. This makes it a valuable tool for a range of applications, including microelectronics and optics.
Overall, sputtering technology is a highly advanced and precise technique that is widely used in a range of industrial applications. Its ability to deposit highly uniform and precise thin films makes it a valuable tool for a range of industries, and its versatility and flexibility make it a key technology in the field of PVD.
Reference
